I-laser iyisisombululo esihlukile sokucubungula i-sandpaper ukuze kuhlangatshezwane nezidingo ezintsha zokucubungula nokukhiqizwa kwama-disc okusawula abrasive, angenakufinyelelwa yi-die cutting yendabuko.
Ukuze kuthuthukiswe izinga lokukhipha uthuli futhi kwandiswe isikhathi sokuphila kwediski yokusila, kudingeka kukhiqizwe izimbobo zokukhipha uthuli ezisezingeni eliphezulu futhi ezingcono kakhulu ebusweni bediski yokusila ethuthukisiwe. Inketho engenzeka yokukhiqiza izimbobo ezincane ephepheni lokusila ukusebenzisa i-i-CO yezimboni2uhlelo lokusika nge-laser.