Yintoni iDie Cutting?
Ukusika idayi yendabuko kubhekisa kwinkqubo yokusika emva kokucubungula izinto eziprintiweyo. Inkqubo yokusika idayi ivumela izinto eziprintiweyo okanye ezinye iimveliso zephepha ukuba zisikwe ngokuhambelana nomzobo oyilwe kwangaphambili ukuvelisa ipleyiti yemela yokusika idayi, ukuze imilo yezinto eziprintiweyo ingasapheleli kwimiphetho ethe tye nakwiikona. Iimela zokusika idayi zesiqhelo zihlanganiswa zibe yipleyiti yokusika idayi ngokusekelwe kumzobo ofunekayo kuyilo lwemveliso. Ukusika idayi yinkqubo yokwenza apho ushicilelo okanye elinye iphepha lisikwa kwimo oyifunayo okanye uphawu lokusika phantsi koxinzelelo. Inkqubo yokusika isebenzisa imela yokusika okanye idayisi yokusika ukucinezela uphawu lomgca kwiphepha ngokucinezela, okanye irola ukuqengqa uphawu lomgca kwiphepha ukuze iphepha ligotywe kwaye lenziwe kwindawo emiselweyo.
Njengeimboni ye-elektronikiiyaqhubeka nokukhula ngokukhawuleza, ingakumbi ngobuninzi beemveliso ze-elektroniki zabathengi, ukusika nge-die akupheleli nje ekucutshungulweni emva kweemveliso eziprintiweyo (umz. iilebheli), kodwa ikwayindlela yokuvelisa.izixhobo ezincedisayo ze-elektroniki zoshishino. Isetyenziswa rhoqo kwi: electro-acoustic, ukhathalelo lwempilo, ukwenziwa kweebhetri, iimpawu zokubonisa, ukhuseleko kunye nokhuseleko, uthutho, izixhobo zeofisi, izixhobo ze-elektroniki kunye namandla, unxibelelwano, ukwenziwa kwemizi-mveliso, ukuzonwabisa ekhaya nakwamanye amashishini. Isetyenziswa kwiifowuni eziphathwayo, i-MID, iikhamera zedijithali, iimoto, i-LCD, i-LED, i-FPC, i-FFC, i-RFID kunye nezinye izinto zemveliso, isetyenziswa kancinci kancinci kwiimveliso ezingasentla zokubopha, ukuthintela uthuli, ukuthintela ukushaqeka, ukuthintela ukugquma, ukuthintela ubushushu, ukukhupha ubushushu, ukhuseleko lwenkqubo, njl. Izinto ezisetyenziselwa ukusika idayi ziquka irabha, iitheyiphu zokuncamathelisa ezinamacala omabini kunye namacala amabini, ifoam, iplastiki, i-vinyl, i-silicon, iifilimu ze-optical, iifilimu zokukhusela, i-gauze, iitheyiphu ezinyibilikayo ezishushu, i-silicone, njl.
Umatshini wokusika iidayi
Izixhobo eziqhelekileyo zokusika iidayi zahlulwe kakhulu zibe ziindidi ezimbini: enye ngumatshini omkhulu wokusika iidayi osetyenziswa ngobuchule ekupakisheni iibhokisi zebhokisi kunye nemibala, kwaye enye ngumatshini wokusika iidayi osetyenziselwa iimveliso ze-elektroniki ezichanekileyo. Into efanayo ngazo zombini kukuba ziimveliso zokubhoboza ngokukhawuleza, zombini zifuna ukusetyenziswa kweenkuni, kwaye zizixhobo ezibalulekileyo ezifunekayo kwiinkqubo zanamhlanje. Iinkqubo ezahlukeneyo zokusika iidayi zonke zisekelwe kumatshini wokusika iidayi, ngoko ke umatshini wokusika iidayi, onxulumene nathi, yeyona nto ibalulekileyo ekusikeni iidayi.
Iintlobo eziqhelekileyo zomatshini wokusika idayisi
Umatshini Wokusika I-Flatbed Die
Indlela yokusika iidayi ezisicaba yeyona ndlela isetyenziswa kakhulu yokusika iidayi ngokwezifiso. Le ndlela kukwenza "imela yentsimbi" ngokweemfuno zomthengi, uze usike iindawo ngokuziqinisa.
Umatshini Wokusika I-Rotary Die
Ukusika iidayi ezijikelezayo kusetyenziswa kakhulu ekusikeni iintambo ezinkulu. Ukusika iidayi ezijikelezayo kusetyenziswa kwizinto ezithambileyo ukuya kweziqinileyo, apho izinto zicinezelwa phakathi kwedayi esisilinda kunye nencakuba yemela kwi-anvil esisilinda ukuze kufezekiswe ukusika. Olu hlobo lusetyenziswa rhoqo ekusikeni iidayi ezingaphakathi.
Umatshini wokusika i-Laser Die
Xa kuthelekiswa noomatshini bokusika iidayi abaqhelekileyo,oomatshini bokusika iidayi nge-laserZizixhobo zokusika iidayi zanamhlanje kwaye zikhethwa kakhulu kwiiprojekthi ezifuna indibaniselwano eyahlukileyo yesantya kunye nokuchaneka. Oomatshini bokusika iidayi nge-laser basebenzisa umqadi we-laser ogxile kakhulu ukuze banqumle izinto zibe luluhlu olungapheliyo lwezinto ezinalo naluphi na uhlobo okanye ubungakanani. Ngokungafaniyo nezinye iintlobo zokusika iidayi, inkqubo ye-laser ayisebenzisi idayisi ebonakalayo.
Enyanisweni, i-laser ikhokelwa kwaye ilawulwa yikhompyutha phantsi kwemiyalelo yoyilo eyenziwe yiCAD. Ukongeza ekunikezeni ukuchaneka okuphezulu kunye nesantya, ii-laser die cutters zilungele ukwenza ii-cuts ezikhawulezileyo okanye ii-prototypes zokuqala.
Oomatshini bokusika iidayi nge-laser bakwizinga eliphezulu ekusikeni izinto ezingenakukwazi ukusingathwa zezinye iintlobo zoomatshini bokusika iidayi. Oomatshini bokusika iidayi nge-laser baya bethandwa kakhulu ngenxa yokuguquguquka kwazo, ukuguquka ngokukhawuleza kunye nokuzivumelanisa nezimo ezibalaseleyo kwimveliso yexesha elifutshane neyenziwe ngokwezifiso.
Isishwankathelo
Ukusika i-die yindlela ebanzi neyinkimbinkimbi yokusika, ebandakanya abasebenzi, izixhobo zoshishino, iinkqubo zoshishino, ulawulo kunye nezinye iiprojekthi. Wonke umenzi ofuna ukusika i-die kufuneka ayinike ingqalelo enkulu, kuba umgangatho wokusika i-die unxulumene ngokuthe ngqo nenqanaba lemveliso yobugcisa yeshishini. Ukusasaza izixhobo ngokuqiqa nangokunesibindi ukuzama iinkqubo ezintsha, izixhobo ezintsha kunye neengcinga ezintsha zezona zinto zibalulekileyo esizidingayo. Uluhlu olukhulu lwezoshishino lweshishini lokusika i-die luyaqhubeka nokuqhuba uphuhliso oluqhubekayo lwazo zonke izimboni. Kwixesha elizayo, uphuhliso lokusika i-die luza kuba lolwesayensi ngakumbi kwaye lube nengqiqo.
