Kuyini Ukuzisika Nge-Die?
Ukusika ngedayi kwendabuko kubhekisela enkambisweni yokusika ngemva kokucubungula izinto eziphrintiwe. Inqubo yokusika ngedayi ivumela izinto eziphrintiwe noma eminye imikhiqizo yephepha ukuthi inqunywe ngokuhambisana nomdwebo oklanywe ngaphambilini ukuze kukhiqizwe ipuleti lommese wokusika ngedayi, ukuze ukuma kwezinto eziphrintiwe kungasagcini emaphethelweni nasemakhoneni aqondile. Imimese yokusika ngedayi evamile ihlanganiswa ibe yipuleti lokusika ngedayi ngokusekelwe emdwebweni odingekayo ekwakhiweni komkhiqizo. Ukusika ngedayi kuyinqubo yokwakha lapho ukuphrinta noma elinye ishidi lisikwa ngesimo esifunwayo noma uphawu lokusika ngaphansi kwengcindezi. Inqubo yokusika isebenzisa ummese wokusika noma idayisi lokusika ukuze kucindezelwe uphawu lomugqa eshidini, noma i-roller ukuze kugoqwe uphawu lomugqa eshidini ukuze ishidi ligotshwe futhi lenziwe endaweni enqunyiwe.
Njengobaimboni ye-elekthronikhiiyaqhubeka nokuthuthuka ngokushesha, ikakhulukazi ngobubanzi obukhulayo bemikhiqizo ye-elekthronikhi yabathengi, ukusika ngodayi akugcini nje ngokukhawulelwa ekucutshungulweni kwemikhiqizo ephrintiwe (isb. amalebula), kodwa futhi kuyindlela yokukhiqizaizinto ezisizayo ze-elekthronikhi zezimboni. Ivame ukusetshenziswa ku: i-electro-acoustic, ukunakekelwa kwempilo, ukukhiqizwa kwebhethri, izimpawu zokubonisa, ukuphepha nokuvikelwa, ezokuthutha, izimpahla zasehhovisi, izinto zikagesi namandla, ezokuxhumana, ukukhiqizwa kwezimboni, ukuzijabulisa kwasekhaya nakwezinye izimboni. Isetshenziswa kumafoni aphathwayo, i-MID, amakhamera edijithali, izimoto, i-LCD, i-LED, i-FPC, i-FFC, i-RFID nezinye izici zomkhiqizo, isetshenziswa kancane kancane emikhiqizweni engenhla yokubopha, ukuvikela uthuli, ukuvikela ukushaqeka, ukuvikela ukushisa, ukuvikela inqubo, njll. Izinto ezisetshenziselwa ukusika nge-die zifaka phakathi irabha, amateyipu okunamathelayo ahlangothi olulodwa namabili, i-foam, ipulasitiki, i-vinyl, i-silicon, amafilimu okukhanya, amafilimu okuvikela, i-gauze, amateyipu okuncibilikisa ashisayo, i-silicone, njll.
Umshini wokusika idayi
Imishini yokusika idayi evamile ihlukaniswe kakhulu ngezigaba ezimbili: eyodwa umshini omkhulu wokusika idayi osetshenziswa ngobungcweti ekupakisheni ibhokisi kanye nombala, kanti enye umshini wokusika idayi osetshenziselwa imikhiqizo ye-elekthronikhi enembile. Okufanayo kokubili ukuthi kuyimikhiqizo yokubhoboza ngokushesha, kokubili kudinga ukusetshenziswa kwesikhunta, futhi kuyimishini ebalulekile ebaluleke kakhulu ezinqubweni zesimanje. Izinqubo ezahlukene zokusika idayi zonke zisekelwe emishinini yokusika idayi, ngakho umshini wokusika idayi, ohlobene kakhulu nathi, uyingxenye ebaluleke kakhulu yokusika idayi.
Izinhlobo ezijwayelekile zomshini wokusika idayisi
Umshini Wokusika I-Flatbed Die
Ukusika idayisi eyisicaba kuyindlela evame ukusetshenziswa kakhulu yokusika idayisi ngokwezifiso. Indlela iwukwenza “ummese wensimbi” ochaza iphrofayili ngokwezidingo zamakhasimende, bese usika izingxenye ngokuzinyathela.
Umshini Wokusika I-Rotary Die
Ukusika nge-rotary kusetshenziselwa kakhulu ukusika nge-bulk web. Ukusika nge-rotary kusetshenziselwa izinto ezithambile kuya kweziqinile kancane, lapho izinto zicindezelwa khona phakathi kwe-cylindrical die kanye ne-blade yommese ku-anvil cylindrical ukuze kufezwe ukusika. Leli fomu livame ukusetshenziswa ekusikeni nge-liner die.
Umshini Wokusika I-Laser Die
Uma kuqhathaniswa nemishini yokusika ngodayi evamile,imishini yokusika ngodayi nge-laserziyindlela yesimanje kakhulu yemishini yokusika idayi futhi ziyinketho ekhethwayo yamaphrojekthi adinga inhlanganisela eyingqayizivele yesivinini nokunemba. Imishini yokusika idayi ye-laser isebenzisa umsebe we-laser ogxile kakhulu ukuze isike izinto kalula zibe yizingxenye eziningi ezingapheli ezinanoma yisiphi isimo noma usayizi. Ngokungafani nezinye izinhlobo zokusika "idayi", inqubo ye-laser ayisebenzisi idayisi ebonakalayo.
Eqinisweni, i-laser iqondiswa futhi ilawulwa yikhompyutha ngaphansi kwemiyalelo yokuklama ekhiqizwe yi-CAD. Ngaphezu kokunikeza ukunemba okuphezulu kanye nesivinini, izicucu ze-laser die zilungele ukudala izicucu zesikhathi esisodwa noma ama-prototype okuqala.
Imishini yokusika i-laser die nayo inhle kakhulu ekusikeni izinto ezinye izinhlobo zemishini yokusika i-die ezingakwazi ukuzisingatha. Imishini yokusika i-laser die ithandwa kakhulu ngenxa yokuguquguquka kwayo, ukushintsha okusheshayo kanye nokuzivumelanisa nezimo okuvelele ekukhiqizweni okufutshane kanye nokwenziwe ngokwezifiso.
Isifinyezo
Ukusika i-die kuyindlela yokusika ephelele neyinkimbinkimbi, ehilela izinsizakusebenza zabantu, imishini yezimboni, izinqubo zezimboni, ukuphathwa kanye neminye imisebenzi. Wonke umenzi odinga ukusika i-die kumele ayinake kakhulu, ngoba ikhwalithi yokusika i-die ihlobene ngqo nezinga lokukhiqiza lobuchwepheshe lemboni. Ukusabalalisa izinsizakusebenza ngokufanele nangesibindi ukuzama izinqubo ezintsha, imishini emisha kanye nemibono emisha kuyikhono esilidingayo. Uchungechunge olukhulu lwezimboni lwemboni yokusika i-die luyaqhubeka nokuqhuba intuthuko eqhubekayo yazo zonke izimboni. Esikhathini esizayo, intuthuko yokusika i-die nakanjani izoba yesayensi futhi inengqondo.
